F.A.S.T.^® (Fast Atomic Sequential Technology)

At the crossroads of CVD and ALD deposition techniques, F.A.S.T.^® proposes: unique film properties, best in class solution for Thick and Conformal layers, and ALD film performances at CVD speed.

Unique Process Control

• Temporal control      
  - Better film properties
• Separate species inlets     
  - No parasitic reactions
• High reaction rate      
  - Lower precursor consumption and higher deposition rate
• Precise volume introduction   
  - Repeatability

Features

• Plasma enhanced deposition
• Unique in-situ cleaning capability
• Single wafer process module
• Low cost of ownership