KOBUS™

OUR KOBUS PRODUCT LINE UTILIZING F.A.S.T.® BRIDGES RATE AND CONFORMALITY BETWEEN CVD AND ALD

When thick and conformal films matter, fast atomic sequential technology (F.A.S.T.) is the solution. Based on Plasma-Therm’s® proprietary chemical vapor deposition (CVD) reactor design combined with pulsed capability, F.A.S.T. offers new solutions for 3D integration challenges and other aggressive aspect ratio applications.

F.A.S.T. delivers film conformality superior to plasma-enhanced CVD (PECVD) at deposition rates greater than that of atomic layer deposition (ALD).

Advanced packaging (through-silicon vias), superconducting films (TiN)
Oxides, nitrides, metals, metal oxides
Liners, barriers, seed layers

Cluster configuration or single process module
Supports 100mm to 200mm substrates
Up to 500C processing temperature
Dual-channel showerhead
Direct liquid injection vaporizer of precursors (2x)
Both high and low frequency RF-driven plasma

The Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity. Cortex benefits include:

Graphical, SEMI-standard (E-95) interface
Comprehensive recipe editing and process parameter data logging and charting (real-time and post-processing)
Automated clean and conditioning routines with configurable triggers
Factory automation host interface (with optional SECS/GEM license)
User-level access control
Auto logging of alarms, jobs, calibration, and resource usage
Integrated with GLANCE™ data logging and visualization tool
Same feature-rich control system as used on high-volume production systems

Kobus tool used for semiconductor manufacturing

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Kobus tool for semiconductor manufacturing

tool used in semiconductor manufacturing

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