Leading technology for Photomask production to 32nm and below

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An increase in device performance along with a reduced price is driving semiconductor innovation. Photomask technology is currently at the front end of the International Technology Roadmap for Semiconductors (ITRS).

Plasma-Therm has been a leading supplier of dry etch systems to the global photomask market for more than 15 years, with the largest installed base for both R&D and production. Extensive experience in this field has resulted in industry technological innovations.

Plasma-Therm provides etch solutions for all major photomask technologies, including chrome (Cr) etch for binary masks, molybdenum silicide (MoSi) etch for embedded attenuated phase-shift masks (EAPSM), and quartz etch for alternating aperture phase-shift masks (AAPSM). Plasma-Therm is focusing on next-generation lithography to develop Nano Imprint and EUV solutions for the photomask industry.

Plasma-Therm's Mask Etcher® systems serve photomask technology nodes to 32nm and below. These systems provide high uptime, low defect density, high uniformity, bias and linearity.

Typical Applications
  • Cr etch
  • Molysilicide etch
  • Quartz etch
  • NGL: Nano-Imprint and EUV



Detail Images


For more information, contact us at information@plasmatherm.com or at +1.727.577.4999


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