Want more info?

Click here for phone, fax and email contact information.

Singulator® dices wafers on industry-standard tape frames.

More good die per wafer

More active si per die

Plasma singulation enables more dies and more active silicon.


MDS-100, MDS-300

Plasma-Therm's Singulator® models MDS-100 and MDS-300 are the first volume-production-ready plasma singulation systems.

Singulator® systems deliver unique benefits compared to traditional dicing techniques, especially for thin and ultra-thin wafers:

  • Smooth sidewalls
  • No lateral damage
  • Improved die strength
  • Street size as small as 10μm and less
  • Dicing of non-rectangular dies (rounded corners, key shape, etc.)

Tape-frame cassette handling system

  • Supports industry-standard dicing tape with plastic or metal frames
  • Load two cassettes with up to 25 frames each
  • Continuous operation for 4-, 6-, 8-inch wafers on 8-inch tape frames, and 12" wafers on tape frames
  • Integrated laminar flow and anti-static bars for operation in backend environment

High-rate process chamber

  • Yield-enhancing, proprietary plasma source
  • Highest throughput — up to 3,000 mm/sec dicing speed equivalent

Process control

  • Integrated endpoint technology with EndpointWorks™ software compensates for non-uniform substrate thickness

On-tape process extendibility

  • TSV reveal
  • Wafer thinning
  • Stress relief

Enhanced productivity with Cortex® control system

  • Automatic data logging and charting
  • Automated maintenance scheduler
  • Factory system integration (SECS/GEM)
  legal notice | privacy policy | site map | © 2019 Plasma-Therm