singulator tool for semiconductor manufacturing

SINGULATOR® MDS-100, MDS-300

SINGULATOR PERFORMS PLASMA WAFER DICING ON INDUSTRY-STANDARD TAPE FRAMES.

Our Singulator® model MDS-100 and MDS-300 systems are the first volume-production-ready plasma singulation systems for plasma dicing on tape (PDOT™). Singulator systems deliver unique benefits compared with traditional dicing techniques, especially for thin and ultra-thin wafers. The Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity. 

  • Optimized handling for processing wafers on standard dicing tape with plastic or metal frames
  • High-power ICP for industry-leading etch rates
  • Substrate temperature control with backside helium and electrostatic clamping
  • Low-particulate processing environment
  • Loading configuration up to two cassettes each for tape frames 
  • Continuous operation for 4-, 6-, and 8-inch wafers on 8-inch tape frames and 12-inch wafers on tape frames
close up of singulator tool for semiconductor dicing

singulator tool for semiconductor dicing

zoomed in photo of semiconductor tool

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